Modeling and characterization of abrasive-free copper chemical mechanical planarization process

Modeling and characterization of abrasive-free copper chemical mechanical planarization process

Master's

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Bibliographic Details
Main Author: TABASSUMUL HAQUE
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Abrasive-free Copper CMP, Material Removal Mechanism, Material Removal Rate, Within Wafer Non-Uniformity, Non-Prestonian Phenomenon, Modes of Contact
Online Access:http://scholarbank.nus.edu.sg/handle/10635/14454
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Institution: National University of Singapore
Language: English

Internet

http://scholarbank.nus.edu.sg/handle/10635/14454

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