Static and dynamic flexure of PCBs in electronic packaging assemblies

Master's

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Bibliographic Details
Main Author:	ONG YEOW CHON
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Electronic packaging, Dynamic drop test, Static bend test, Solder interconnection, Solder joint, Drop impact test
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/15322
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-15322
record_format	dspace
spelling	sg-nus-scholar.10635-153222015-01-08T00:58:42Z Static and dynamic flexure of PCBs in electronic packaging assemblies ONG YEOW CHON MECHANICAL ENGINEERING LIM CHWEE TECK SHIM PHYAU WUI, VICTOR Electronic packaging, Dynamic drop test, Static bend test, Solder interconnection, Solder joint, Drop impact test Master's MASTER OF ENGINEERING 2010-04-08T10:52:19Z 2010-04-08T10:52:19Z 2006-04-30 Thesis ONG YEOW CHON (2006-04-30). Static and dynamic flexure of PCBs in electronic packaging assemblies. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/15322 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Electronic packaging, Dynamic drop test, Static bend test, Solder interconnection, Solder joint, Drop impact test
spellingShingle	Electronic packaging, Dynamic drop test, Static bend test, Solder interconnection, Solder joint, Drop impact test ONG YEOW CHON Static and dynamic flexure of PCBs in electronic packaging assemblies
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING ONG YEOW CHON
format	Theses and Dissertations
author	ONG YEOW CHON
author_sort	ONG YEOW CHON
title	Static and dynamic flexure of PCBs in electronic packaging assemblies
title_short	Static and dynamic flexure of PCBs in electronic packaging assemblies
title_full	Static and dynamic flexure of PCBs in electronic packaging assemblies
title_fullStr	Static and dynamic flexure of PCBs in electronic packaging assemblies
title_full_unstemmed	Static and dynamic flexure of PCBs in electronic packaging assemblies
title_sort	static and dynamic flexure of pcbs in electronic packaging assemblies
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/15322
_version_	1681079175345078272

Static and dynamic flexure of PCBs in electronic packaging assemblies

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