STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT

STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT

Master's

Saved in:
Bibliographic Details
Main Author: WONG KAH LEONG
Other Authors: SINGAPORE-MIT ALLIANCE
Format: Theses and Dissertations
Published: 2019
Subjects:
Low k dielectric
CVD
CoralTM
Etching
Plasma treatment
Stripping
Ashing
Cleaning
Integrated k
Online Access:https://scholarbank.nus.edu.sg/handle/10635/154133
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-154133
record_format dspace
spelling sg-nus-scholar.10635-1541332019-05-15T13:14:49Z STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT WONG KAH LEONG SINGAPORE-MIT ALLIANCE JEFFREY SU YONG JIE PEY KIN LEONG Low k dielectric CVD CoralTM Etching Plasma treatment Stripping Ashing Cleaning Integrated k Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-15T04:18:32Z 2019-05-15T04:18:32Z 2003 Thesis WONG KAH LEONG (2003). STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154133 SMA BATCHLOAD 20190422
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic Low k dielectric
CVD
CoralTM
Etching
Plasma treatment
Stripping
Ashing
Cleaning
Integrated k
spellingShingle Low k dielectric
CVD
CoralTM
Etching
Plasma treatment
Stripping
Ashing
Cleaning
Integrated k
WONG KAH LEONG
STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
description Master's
author2 SINGAPORE-MIT ALLIANCE
author_facet SINGAPORE-MIT ALLIANCE
WONG KAH LEONG
format Theses and Dissertations
author WONG KAH LEONG
author_sort WONG KAH LEONG
title STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_short STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_full STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_fullStr STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_full_unstemmed STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_sort study of process impact on k value of low k dielectric material used in cu / low k dual damascene interconnect
publishDate 2019
url https://scholarbank.nus.edu.sg/handle/10635/154133
_version_ 1681099342410153984

Similar Items