STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT

STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT

Master's

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Bibliographic Details
Main Author: WONG KAH LEONG
Other Authors: SINGAPORE-MIT ALLIANCE
Format: Theses and Dissertations
Published: 2019
Subjects:
Low k dielectric
CVD
CoralTM
Etching
Plasma treatment
Stripping
Ashing
Cleaning
Integrated k
Online Access:https://scholarbank.nus.edu.sg/handle/10635/154133
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-1541332024-10-26T00:12:16Z STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT WONG KAH LEONG SINGAPORE-MIT ALLIANCE JEFFREY SU YONG JIE PEY KIN LEONG Low k dielectric CVD CoralTM Etching Plasma treatment Stripping Ashing Cleaning Integrated k Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS Dissertation Advisor: 1. Assoc. Prof. Pey Kin Leong, SMA Fellow, NTU, IME Supervisor: Dr. Jeffrey Su Yong Jie, Technical Manager, SPT Laboratory 2019-05-15T04:18:32Z 2019-05-15T04:18:32Z 2003 Thesis WONG KAH LEONG (2003). STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154133 SMA BATCHLOAD 20190422
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Low k dielectric
CVD
CoralTM
Etching
Plasma treatment
Stripping
Ashing
Cleaning
Integrated k
spellingShingle Low k dielectric
CVD
CoralTM
Etching
Plasma treatment
Stripping
Ashing
Cleaning
Integrated k
WONG KAH LEONG
STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
description Master's
author2 SINGAPORE-MIT ALLIANCE
author_facet SINGAPORE-MIT ALLIANCE
WONG KAH LEONG
format Theses and Dissertations
author WONG KAH LEONG
author_sort WONG KAH LEONG
title STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_short STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_full STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_fullStr STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_full_unstemmed STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
title_sort study of process impact on k value of low k dielectric material used in cu / low k dual damascene interconnect
publishDate 2019
url https://scholarbank.nus.edu.sg/handle/10635/154133
_version_ 1821204011655626752

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