STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT

STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT

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書目詳細資料
主要作者:	WONG KAH LEONG
其他作者:	SINGAPORE-MIT ALLIANCE
格式:	Theses and Dissertations
出版:	2019
主題:	Low k dielectric CVD CoralTM Etching Plasma treatment Stripping Ashing Cleaning Integrated k
在線閱讀:	https://scholarbank.nus.edu.sg/handle/10635/154133
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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