A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES

Master's

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Bibliographic Details
Main Author: XIONG ZHENGPENG
Other Authors: DEPT OF MECHANICAL ENGINEERING
Format: Theses and Dissertations
Published: 2019
Online Access:https://scholarbank.nus.edu.sg/handle/10635/159990
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Institution: National University of Singapore
Description
Summary:Master's