A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
Master's
Saved in:
Main Author: | XIONG ZHENGPENG |
---|---|
Other Authors: | DEPT OF MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Published: |
2019
|
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/159990 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
by: XIONG ZHENGPENG
Published: (2019) -
Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package
by: Hu, G., et al.
Published: (2014) -
Warpage study of plastic endapsulated IC package
by: Gan, Swee Lee
Published: (2008) -
Criterion for predicting delamination in plastic IC packages
by: Tay, A.A.O., et al.
Published: (2014) -
HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
by: LIN TINGYU
Published: (2019)