A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES

Master's

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Bibliographic Details
Main Author:	XIONG ZHENGPENG
Other Authors:	DEPT OF MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Published:	2019
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/159990
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-159990
record_format	dspace
spelling	sg-nus-scholar.10635-1599902019-10-18T05:43:54Z A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES XIONG ZHENGPENG DEPT OF MECHANICAL ENGINEERING ANDREW A.O. TAY Master's MASTER OF ENGINEERING 2019-10-18T05:43:54Z 2019-10-18T05:43:54Z 2001 Thesis XIONG ZHENGPENG (2001). A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/159990 CCK BATCHLOAD 20190911
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Master's
author2	DEPT OF MECHANICAL ENGINEERING
author_facet	DEPT OF MECHANICAL ENGINEERING XIONG ZHENGPENG
format	Theses and Dissertations
author	XIONG ZHENGPENG
spellingShingle	XIONG ZHENGPENG A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
author_sort	XIONG ZHENGPENG
title	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_short	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_full	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_fullStr	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_full_unstemmed	A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
title_sort	numerical study of fracture in plastic ic packages
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/159990
_version_	1681099993098747904

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