Failure in metallization systems

Master's

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Bibliographic Details
Main Author:	HO CHEE SHENG
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2019
Subjects:	Ta, TaN, Cu Interconnect, Stress-induced voiding, MELT, adhesion
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/161007
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-161007
record_format	dspace
spelling	sg-nus-scholar.10635-1610072024-10-25T14:04:06Z Failure in metallization systems HO CHEE SHENG MECHANICAL ENGINEERING LIM YUI HUNG, CHRISTINA Ta, TaN, Cu Interconnect, Stress-induced voiding, MELT, adhesion Master's MASTER OF ENGINEERING 2019-10-31T18:03:09Z 2019-10-31T18:03:09Z 2004-12-28 Thesis HO CHEE SHENG (2004-12-28). Failure in metallization systems. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/161007 en
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	Ta, TaN, Cu Interconnect, Stress-induced voiding, MELT, adhesion
spellingShingle	Ta, TaN, Cu Interconnect, Stress-induced voiding, MELT, adhesion HO CHEE SHENG Failure in metallization systems
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING HO CHEE SHENG
format	Theses and Dissertations
author	HO CHEE SHENG
author_sort	HO CHEE SHENG
title	Failure in metallization systems
title_short	Failure in metallization systems
title_full	Failure in metallization systems
title_fullStr	Failure in metallization systems
title_full_unstemmed	Failure in metallization systems
title_sort	failure in metallization systems
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/161007
_version_	1821211072183402496

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