Mechanical response of portable electronic products to drop impact
Master's
Saved in:
Main Author: | ANG CHIA WEI |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2010
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/17063 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Language: | English |
Similar Items
-
Numerical simulation of the drop impact response of a portable electronic product
by: Lim, C.-T., et al.
Published: (2014) -
Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
by: SEAH KAH WOON, SIMON
Published: (2012) -
Dewetting at the center of a drop impact
by: Thoroddsen, S.T., et al.
Published: (2014) -
Experimental study of liquid drop impact onto a powder surface
by: Marston, J.O., et al.
Published: (2014) -
Finite element modeling of electronic packages subjected to drop impact
by: Tan, V.B.C., et al.
Published: (2014)