Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistor

Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistor

10.1021/acsanm.0c03283

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Bibliographic Details
Main Authors: UTKARSH ANAND, TANMAY GHOSH, ZAINUL AABDIN, Nandi Vrancken, YAN HONGWEI, XiuMei Xu, Frank Holsteyns, UTKUR MIRZIYODOVICH MIRSAIDOV
Other Authors: BIOLOGICAL SCIENCES
Format: Article
Published: ACS Applied Nano Materials 2021
Subjects:
liquid-phase TEM
machine learning
nanofabrication
nanostructures
pattern collapse
Online Access:https://scholarbank.nus.edu.sg/handle/10635/187520
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Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/187520

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