On-Chip Links with Energy-Quality Tradeoff in Error-Resilient and Machine Learning Applications
IEEE JOURNAL OF SOLID-STATE CIRCUITS
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| Main Authors: | , |
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| Format: | Article |
| Published: |
IEEE
2021
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| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/192293 |
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| Institution: | National University of Singapore |
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