Transfer learning-based artificial intelligence-integrated physical modeling to enable failure analysis for 3 nanometer and smaller silicon-based CMOS transistors

Transfer learning-based artificial intelligence-integrated physical modeling to enable failure analysis for 3 nanometer and smaller silicon-based CMOS transistors

10.1021/acsanm.1c00960

Saved in:
Bibliographic Details
Main Authors: JIEMING PAN, LOW KAIN LU, JOYDEEP GHOSH, Senthilnath Jayavelu, Md Meftahul Ferdaus, Shang Yi Lim, Evgeny Zamburg, Li Yida, TANG BAOSHAN, WANG XINGHUA, LEONG JIN FENG, Savitha Ramasamy, Tonio Buonassisi, Tham Chen Khong, THEAN VOON YEW, AARON
Other Authors: COLLEGE OF DESIGN AND ENGINEERING
Format: Article
Language:English
Published: ACS Applied Nano Materials 2022
Subjects:
failure analysis transistor bridge defect CMOS FinFET GAAFET technology computer-aided design (TCAD) machine learning transfer learning
Online Access:https://scholarbank.nus.edu.sg/handle/10635/218176
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Language: English

Internet

https://scholarbank.nus.edu.sg/handle/10635/218176

Similar Items