Wafer level super stretch solder

US6890795

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Bibliographic Details
Main Authors:	WONG, EE HUA, RAJOO, RANJAN, TEO, POI SIONG
Other Authors:	MECHANICAL ENGINEERING
Format:	Patent
Published:	2012
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/32698
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-32698
record_format	dspace
spelling	sg-nus-scholar.10635-326982015-07-29T07:03:53Z Wafer level super stretch solder WONG, EE HUA RAJOO, RANJAN TEO, POI SIONG MECHANICAL ENGINEERING INSTITUTE OF MICROELECTRONICS AGENCY FOR SCIENCE, TECHNOLOGY & RESEARCH (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) GEORGIA TECH RESEARCH CORPORATION US6890795 Granted Patent 2012-05-02T02:29:03Z 2012-05-02T02:29:03Z 2005-05-10 Patent WONG, EE HUA,RAJOO, RANJAN,TEO, POI SIONG (2005-05-10). Wafer level super stretch solder. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32698 NOT_IN_WOS PatSnap
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	US6890795
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING WONG, EE HUA RAJOO, RANJAN TEO, POI SIONG
format	Patent
author	WONG, EE HUA RAJOO, RANJAN TEO, POI SIONG
spellingShingle	WONG, EE HUA RAJOO, RANJAN TEO, POI SIONG Wafer level super stretch solder
author_sort	WONG, EE HUA
title	Wafer level super stretch solder
title_short	Wafer level super stretch solder
title_full	Wafer level super stretch solder
title_fullStr	Wafer level super stretch solder
title_full_unstemmed	Wafer level super stretch solder
title_sort	wafer level super stretch solder
publishDate	2012
url	http://scholarbank.nus.edu.sg/handle/10635/32698
_version_	1681081270666264576

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