Post-cure shrinkage of photo-sensitive material used in laser lithography process

Post-cure shrinkage of photo-sensitive material used in laser lithography process

Journal of Materials Processing Technology

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Bibliographic Details
Main Authors: Fuh, J.Y.H., Chooo, Y.S., Lu, L., Nee, A.Y.C., Wong, Y.S., Wang, W.L., Miyazawa, T., Ho, S.H.
Other Authors: CAE/CAD/CAM CENTRE
Format: Article
Published: 2014
Subjects:
Laser lithography
Photo-polymerisation
Shrinkage
Thermal curing
UV curing
Online Access:http://scholarbank.nus.edu.sg/handle/10635/50381
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/50381

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