Effect of wirebond geometry and die setting on wire sweep

10.1109/96.365509

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Bibliographic Details
Main Authors:	Tay, A.A.O., Yeo, K.S., Wu, J.H.
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51704
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Institution:	National University of Singapore

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Summary:	10.1109/96.365509

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