Effect of wirebond geometry and die setting on wire sweep
10.1109/96.365509
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sg-nus-scholar.10635-517042024-11-13T13:22:57Z Effect of wirebond geometry and die setting on wire sweep Tay, A.A.O. Yeo, K.S. Wu, J.H. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING 10.1109/96.365509 IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging 18 1 201-209 IMTBE 2014-04-25T07:55:03Z 2014-04-25T07:55:03Z 1995-02 Article Tay, A.A.O., Yeo, K.S., Wu, J.H. (1995-02). Effect of wirebond geometry and die setting on wire sweep. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging 18 (1) : 201-209. ScholarBank@NUS Repository. https://doi.org/10.1109/96.365509 10709894 http://scholarbank.nus.edu.sg/handle/10635/51704 A1995QH13100034 Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| description |
10.1109/96.365509 |
| author2 |
INSTITUTE OF MICROELECTRONICS |
| author_facet |
INSTITUTE OF MICROELECTRONICS Tay, A.A.O. Yeo, K.S. Wu, J.H. |
| format |
Article |
| author |
Tay, A.A.O. Yeo, K.S. Wu, J.H. |
| spellingShingle |
Tay, A.A.O. Yeo, K.S. Wu, J.H. Effect of wirebond geometry and die setting on wire sweep |
| author_sort |
Tay, A.A.O. |
| title |
Effect of wirebond geometry and die setting on wire sweep |
| title_short |
Effect of wirebond geometry and die setting on wire sweep |
| title_full |
Effect of wirebond geometry and die setting on wire sweep |
| title_fullStr |
Effect of wirebond geometry and die setting on wire sweep |
| title_full_unstemmed |
Effect of wirebond geometry and die setting on wire sweep |
| title_sort |
effect of wirebond geometry and die setting on wire sweep |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/51704 |
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1821190327813275648 |