Effect of wirebond geometry and die setting on wire sweep

10.1109/96.365509

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Bibliographic Details
Main Authors:	Tay, A.A.O., Yeo, K.S., Wu, J.H.
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51704
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-517042023-10-30T09:51:21Z Effect of wirebond geometry and die setting on wire sweep Tay, A.A.O. Yeo, K.S. Wu, J.H. MECHANICAL & PRODUCTION ENGINEERING INSTITUTE OF MICROELECTRONICS 10.1109/96.365509 IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging 18 1 201-209 IMTBE 2014-04-25T07:55:03Z 2014-04-25T07:55:03Z 1995-02 Article Tay, A.A.O., Yeo, K.S., Wu, J.H. (1995-02). Effect of wirebond geometry and die setting on wire sweep. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging 18 (1) : 201-209. ScholarBank@NUS Repository. https://doi.org/10.1109/96.365509 10709894 http://scholarbank.nus.edu.sg/handle/10635/51704 A1995QH13100034 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/96.365509
author2	MECHANICAL & PRODUCTION ENGINEERING
author_facet	MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Yeo, K.S. Wu, J.H.
format	Article
author	Tay, A.A.O. Yeo, K.S. Wu, J.H.
spellingShingle	Tay, A.A.O. Yeo, K.S. Wu, J.H. Effect of wirebond geometry and die setting on wire sweep
author_sort	Tay, A.A.O.
title	Effect of wirebond geometry and die setting on wire sweep
title_short	Effect of wirebond geometry and die setting on wire sweep
title_full	Effect of wirebond geometry and die setting on wire sweep
title_fullStr	Effect of wirebond geometry and die setting on wire sweep
title_full_unstemmed	Effect of wirebond geometry and die setting on wire sweep
title_sort	effect of wirebond geometry and die setting on wire sweep
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/51704
_version_	1781411716745134080

Effect of wirebond geometry and die setting on wire sweep

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