Simulation of three-dimensional wirebond deformation during transfer molding

Proceedings - Electronic Components and Technology Conference

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Main Authors: Tay, A.A.O., Yeo, K.S., Wu, J.H.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51746
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-517462015-01-07T06:01:05Z Simulation of three-dimensional wirebond deformation during transfer molding Tay, A.A.O. Yeo, K.S. Wu, J.H. MECHANICAL & PRODUCTION ENGINEERING INSTITUTE OF MICROELECTRONICS Proceedings - Electronic Components and Technology Conference 999-1004 PECCA 2014-04-25T07:58:24Z 2014-04-25T07:58:24Z 1995 Conference Paper Tay, A.A.O.,Yeo, K.S.,Wu, J.H. (1995). Simulation of three-dimensional wirebond deformation during transfer molding. Proceedings - Electronic Components and Technology Conference : 999-1004. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/51746 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
Tay, A.A.O.
Yeo, K.S.
Wu, J.H.
format Conference or Workshop Item
author Tay, A.A.O.
Yeo, K.S.
Wu, J.H.
spellingShingle Tay, A.A.O.
Yeo, K.S.
Wu, J.H.
Simulation of three-dimensional wirebond deformation during transfer molding
author_sort Tay, A.A.O.
title Simulation of three-dimensional wirebond deformation during transfer molding
title_short Simulation of three-dimensional wirebond deformation during transfer molding
title_full Simulation of three-dimensional wirebond deformation during transfer molding
title_fullStr Simulation of three-dimensional wirebond deformation during transfer molding
title_full_unstemmed Simulation of three-dimensional wirebond deformation during transfer molding
title_sort simulation of three-dimensional wirebond deformation during transfer molding
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/51746
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