Simulation of three-dimensional wirebond deformation during transfer molding

Proceedings - Electronic Components and Technology Conference

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Main Authors: Tay, A.A.O., Yeo, K.S., Wu, J.H.
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51746
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-517462024-11-13T13:22:57Z Simulation of three-dimensional wirebond deformation during transfer molding Tay, A.A.O. Yeo, K.S. Wu, J.H. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 999-1004 PECCA 2014-04-25T07:58:24Z 2014-04-25T07:58:24Z 1995 Conference Paper Tay, A.A.O.,Yeo, K.S.,Wu, J.H. (1995). Simulation of three-dimensional wirebond deformation during transfer molding. Proceedings - Electronic Components and Technology Conference : 999-1004. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/51746 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 INSTITUTE OF MICROELECTRONICS
author_facet INSTITUTE OF MICROELECTRONICS
Tay, A.A.O.
Yeo, K.S.
Wu, J.H.
format Conference or Workshop Item
author Tay, A.A.O.
Yeo, K.S.
Wu, J.H.
spellingShingle Tay, A.A.O.
Yeo, K.S.
Wu, J.H.
Simulation of three-dimensional wirebond deformation during transfer molding
author_sort Tay, A.A.O.
title Simulation of three-dimensional wirebond deformation during transfer molding
title_short Simulation of three-dimensional wirebond deformation during transfer molding
title_full Simulation of three-dimensional wirebond deformation during transfer molding
title_fullStr Simulation of three-dimensional wirebond deformation during transfer molding
title_full_unstemmed Simulation of three-dimensional wirebond deformation during transfer molding
title_sort simulation of three-dimensional wirebond deformation during transfer molding
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/51746
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