Simulation of three-dimensional wirebond deformation during transfer molding
Proceedings - Electronic Components and Technology Conference
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sg-nus-scholar.10635-517462015-01-07T06:01:05Z Simulation of three-dimensional wirebond deformation during transfer molding Tay, A.A.O. Yeo, K.S. Wu, J.H. MECHANICAL & PRODUCTION ENGINEERING INSTITUTE OF MICROELECTRONICS Proceedings - Electronic Components and Technology Conference 999-1004 PECCA 2014-04-25T07:58:24Z 2014-04-25T07:58:24Z 1995 Conference Paper Tay, A.A.O.,Yeo, K.S.,Wu, J.H. (1995). Simulation of three-dimensional wirebond deformation during transfer molding. Proceedings - Electronic Components and Technology Conference : 999-1004. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/51746 NOT_IN_WOS Scopus |
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Proceedings - Electronic Components and Technology Conference |
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MECHANICAL & PRODUCTION ENGINEERING |
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MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Yeo, K.S. Wu, J.H. |
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Conference or Workshop Item |
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Tay, A.A.O. Yeo, K.S. Wu, J.H. |
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Tay, A.A.O. Yeo, K.S. Wu, J.H. Simulation of three-dimensional wirebond deformation during transfer molding |
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Tay, A.A.O. |
title |
Simulation of three-dimensional wirebond deformation during transfer molding |
title_short |
Simulation of three-dimensional wirebond deformation during transfer molding |
title_full |
Simulation of three-dimensional wirebond deformation during transfer molding |
title_fullStr |
Simulation of three-dimensional wirebond deformation during transfer molding |
title_full_unstemmed |
Simulation of three-dimensional wirebond deformation during transfer molding |
title_sort |
simulation of three-dimensional wirebond deformation during transfer molding |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/51746 |
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