Simulation of three-dimensional wirebond deformation during transfer molding
Proceedings - Electronic Components and Technology Conference
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Main Authors: | Tay, A.A.O., Yeo, K.S., Wu, J.H. |
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Other Authors: | MECHANICAL & PRODUCTION ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/51746 |
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Institution: | National University of Singapore |
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