Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

10.1007/s003960100485

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Bibliographic Details
Main Authors:	Yang, G.H., Kang, E.T., Neoh, K.G., Zhang, Y., Tan, K.L.
Other Authors:	CHEMICAL & ENVIRONMENTAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Copper Electroless plating Graft copolymerization Polyimide Surface
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/52656
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-52656
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spelling	sg-nus-scholar.10635-526562023-10-26T08:15:49Z Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers Yang, G.H. Kang, E.T. Neoh, K.G. Zhang, Y. Tan, K.L. CHEMICAL & ENVIRONMENTAL ENGINEERING PHYSICS Copper Electroless plating Graft copolymerization Polyimide Surface 10.1007/s003960100485 Colloid and Polymer Science 279 8 745-753 CPMSB 2014-05-16T07:24:27Z 2014-05-16T07:24:27Z 2001 Article Yang, G.H., Kang, E.T., Neoh, K.G., Zhang, Y., Tan, K.L. (2001). Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers. Colloid and Polymer Science 279 (8) : 745-753. ScholarBank@NUS Repository. https://doi.org/10.1007/s003960100485 0303402X http://scholarbank.nus.edu.sg/handle/10635/52656 000170520300003 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Copper Electroless plating Graft copolymerization Polyimide Surface
spellingShingle	Copper Electroless plating Graft copolymerization Polyimide Surface Yang, G.H. Kang, E.T. Neoh, K.G. Zhang, Y. Tan, K.L. Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
description	10.1007/s003960100485
author2	CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet	CHEMICAL & ENVIRONMENTAL ENGINEERING Yang, G.H. Kang, E.T. Neoh, K.G. Zhang, Y. Tan, K.L.
format	Article
author	Yang, G.H. Kang, E.T. Neoh, K.G. Zhang, Y. Tan, K.L.
author_sort	Yang, G.H.
title	Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
title_short	Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
title_full	Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
title_fullStr	Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
title_full_unstemmed	Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
title_sort	electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/52656
_version_	1781411787366727680

Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

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