Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

10.1007/s003960100485

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Bibliographic Details
Main Authors: Yang, G.H., Kang, E.T., Neoh, K.G., Zhang, Y., Tan, K.L.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Copper
Electroless plating
Graft copolymerization
Polyimide
Surface
Online Access:http://scholarbank.nus.edu.sg/handle/10635/52656
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/52656

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