A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon

10.1002/smll.200700728

Saved in:

Bibliographic Details
Main Authors:	Choi, W.K., Liew, T.H., Chew, H.G., Zheng, F., Thompson, C.V., Wang, Y., Hong, M.H., Wang, X.D., Li, L., Yun, J.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Gold Nanolithography Nanomanipulation Nanoparticles Silicon surfaces
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/53959
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-53959
record_format	dspace
spelling	sg-nus-scholar.10635-539592024-11-14T20:39:21Z A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon Choi, W.K. Liew, T.H. Chew, H.G. Zheng, F. Thompson, C.V. Wang, Y. Hong, M.H. Wang, X.D. Li, L. Yun, J. ELECTRICAL & COMPUTER ENGINEERING SINGAPORE-MIT ALLIANCE Gold Nanolithography Nanomanipulation Nanoparticles Silicon surfaces 10.1002/smll.200700728 Small 4 3 330-333 2014-06-16T09:24:27Z 2014-06-16T09:24:27Z 2008-03 Article Choi, W.K., Liew, T.H., Chew, H.G., Zheng, F., Thompson, C.V., Wang, Y., Hong, M.H., Wang, X.D., Li, L., Yun, J. (2008-03). A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon. Small 4 (3) : 330-333. ScholarBank@NUS Repository. https://doi.org/10.1002/smll.200700728 16136810 http://scholarbank.nus.edu.sg/handle/10635/53959 000254444200009 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Gold Nanolithography Nanomanipulation Nanoparticles Silicon surfaces
spellingShingle	Gold Nanolithography Nanomanipulation Nanoparticles Silicon surfaces Choi, W.K. Liew, T.H. Chew, H.G. Zheng, F. Thompson, C.V. Wang, Y. Hong, M.H. Wang, X.D. Li, L. Yun, J. A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
description	10.1002/smll.200700728
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Choi, W.K. Liew, T.H. Chew, H.G. Zheng, F. Thompson, C.V. Wang, Y. Hong, M.H. Wang, X.D. Li, L. Yun, J.
format	Article
author	Choi, W.K. Liew, T.H. Chew, H.G. Zheng, F. Thompson, C.V. Wang, Y. Hong, M.H. Wang, X.D. Li, L. Yun, J.
author_sort	Choi, W.K.
title	A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
title_short	A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
title_full	A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
title_fullStr	A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
title_full_unstemmed	A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
title_sort	combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/53959
_version_	1821208844453281792

A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon

Similar Items