A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon

10.1002/smll.200700728

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Bibliographic Details
Main Authors:	Choi, W.K., Liew, T.H., Chew, H.G., Zheng, F., Thompson, C.V., Wang, Y., Hong, M.H., Wang, X.D., Li, L., Yun, J.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Gold Nanolithography Nanomanipulation Nanoparticles Silicon surfaces
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/53959
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Institution:	National University of Singapore

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