A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon
10.1002/smll.200700728
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Main Authors: | Choi, W.K., Liew, T.H., Chew, H.G., Zheng, F., Thompson, C.V., Wang, Y., Hong, M.H., Wang, X.D., Li, L., Yun, J. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/53959 |
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Institution: | National University of Singapore |
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