Angular effect in laser removal of spherical silica particles from silicon wafers
10.1063/1.1359154
Saved in:
Main Authors: | Zheng, Y.W., Lu, Y.F., Song, W.D. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/55116 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Laser induced removal of spherical particles from silicon wafers
by: Lu, Y.F., et al.
Published: (2014) -
Removing spherical silica particles from Si, Ge and NiP substrates by KrF excimer laser
by: Zheng, Y.-W., et al.
Published: (2014) -
Energy approach to the modelling of particle removal by pulsed laser irradiation
by: Lu, Y.F., et al.
Published: (2014) -
Characterization of ejected particles during laser cleaning
by: Lu, Y.F., et al.
Published: (2014) -
Preparation of (0 0 1)-oriented PZT thin films on silicon wafers using pulsed laser deposition
by: Zhao, J., et al.
Published: (2014)