Seal and encapsulate cavities for complementary metal-oxide-semiconductor microelectromechanical system thermoelectric power generators

Seal and encapsulate cavities for complementary metal-oxide-semiconductor microelectromechanical system thermoelectric power generators

10.1116/1.3556954

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Bibliographic Details
Main Authors: Xie, J., Lee, C., Wang, M.-F., Feng, H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/57342
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Institution: National University of Singapore
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Summary:10.1116/1.3556954

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