Seal and encapsulate cavities for complementary metal-oxide-semiconductor microelectromechanical system thermoelectric power generators
10.1116/1.3556954
Saved in:
Main Authors: | Xie, J., Lee, C., Wang, M.-F., Feng, H. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/57342 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
by: Xie, J., et al.
Published: (2014) -
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path
by: Lee, C., et al.
Published: (2014) -
Complementary metal-oxide-semiconductor compatible Al-catalyzed silicon nanowires
by: Whang, S.J., et al.
Published: (2014) -
Germanium nanowire metal-oxide-semiconductor field-effect transistor fabricated by complementary-metal-oxide-semiconductor-compatible process
by: Peng, J.W., et al.
Published: (2014) -
Etching of TiN-based gates for advanced complementary metal-oxide- semiconductor devices
by: Bliznetsov, V., et al.
Published: (2014)