Boundary element analysis of delamination in IC packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

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Bibliographic Details
Main Authors: Tay, A.A.O., Lee, K.H., Lim, K.M.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/57969
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Institution: National University of Singapore