Boundary element analysis of delamination in IC packages
Proceedings of the Electronic Packaging Technology Conference, EPTC
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Main Authors: | Tay, A.A.O., Lee, K.H., Lim, K.M. |
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Other Authors: | MECHANICAL & PRODUCTION ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/57969 |
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Institution: | National University of Singapore |
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