Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages

Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages

American Society of Mechanical Engineers, EEP

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Bibliographic Details
Main Authors: Lin, T.Y., Tay, A.A.O.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/58159
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Institution: National University of Singapore
Description
Summary:American Society of Mechanical Engineers, EEP

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