Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages
American Society of Mechanical Engineers, EEP
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sg-nus-scholar.10635-581592015-01-07T09:31:31Z Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages Lin, T.Y. Tay, A.A.O. MECHANICAL & PRODUCTION ENGINEERING American Society of Mechanical Engineers, EEP 19 2 1429-1436 EEAEE 2014-06-17T05:11:31Z 2014-06-17T05:11:31Z 1997 Article Lin, T.Y.,Tay, A.A.O. (1997). Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages. American Society of Mechanical Engineers, EEP 19 (2) : 1429-1436. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/58159 NOT_IN_WOS Scopus |
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American Society of Mechanical Engineers, EEP |
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MECHANICAL & PRODUCTION ENGINEERING |
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MECHANICAL & PRODUCTION ENGINEERING Lin, T.Y. Tay, A.A.O. |
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Lin, T.Y. Tay, A.A.O. |
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Lin, T.Y. Tay, A.A.O. Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
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Lin, T.Y. |
title |
Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
title_short |
Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
title_full |
Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
title_fullStr |
Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
title_full_unstemmed |
Dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
title_sort |
dynamics of moisture diffusion, hygrothermal stresses and delamination in plasticic packages |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/58159 |
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