Finite element analysis of plastic-encapsulated Multi-Chip Packages
Proceedings of the Electronic Packaging Technology Conference, EPTC
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| Main Authors: | , , |
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| 格式: | Article |
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2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/58289 |
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| 總結: | Proceedings of the Electronic Packaging Technology Conference, EPTC |
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