Finite element analysis of plastic-encapsulated Multi-Chip Packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

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Bibliographic Details
Main Authors:	Tay, A.A.O., Ong, S.H., Lee, L.W.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/58289
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-58289
record_format	dspace
spelling	sg-nus-scholar.10635-582892015-03-26T19:35:12Z Finite element analysis of plastic-encapsulated Multi-Chip Packages Tay, A.A.O. Ong, S.H. Lee, L.W. ELECTRICAL ENGINEERING MECHANICAL & PRODUCTION ENGINEERING Proceedings of the Electronic Packaging Technology Conference, EPTC 170-176 00313 2014-06-17T05:12:55Z 2014-06-17T05:12:55Z 1998 Article Tay, A.A.O.,Ong, S.H.,Lee, L.W. (1998). Finite element analysis of plastic-encapsulated Multi-Chip Packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 170-176. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/58289 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of the Electronic Packaging Technology Conference, EPTC
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING Tay, A.A.O. Ong, S.H. Lee, L.W.
format	Article
author	Tay, A.A.O. Ong, S.H. Lee, L.W.
spellingShingle	Tay, A.A.O. Ong, S.H. Lee, L.W. Finite element analysis of plastic-encapsulated Multi-Chip Packages
author_sort	Tay, A.A.O.
title	Finite element analysis of plastic-encapsulated Multi-Chip Packages
title_short	Finite element analysis of plastic-encapsulated Multi-Chip Packages
title_full	Finite element analysis of plastic-encapsulated Multi-Chip Packages
title_fullStr	Finite element analysis of plastic-encapsulated Multi-Chip Packages
title_full_unstemmed	Finite element analysis of plastic-encapsulated Multi-Chip Packages
title_sort	finite element analysis of plastic-encapsulated multi-chip packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/58289
_version_	1681085021005283328

Finite element analysis of plastic-encapsulated Multi-Chip Packages

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