Influence of temperature humidity and defect location on delamination in plastic 1c packages

Influence of temperature humidity and defect location on delamination in plastic 1c packages

10.1109/6144.814966

Saved in:
Bibliographic Details
Main Author: Tay, A.A.O.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Subjects:
1c packages
Delamination propagation
Humidity
Interface toughness
Location effects
Temperature
Online Access:http://scholarbank.nus.edu.sg/handle/10635/58397
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:10.1109/6144.814966

Similar Items