Moisture diffusion and heat transfer in plastic IC packages

10.1109/95.506103

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Bibliographic Details
Main Authors:	Tay, A.A.O., Lin, T.
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Article
Published:	2014
Subjects:	Finite-element simulation Heat transfer Moisture Plastic IC packages
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/58508
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-58508
record_format	dspace
spelling	sg-nus-scholar.10635-585082023-10-29T21:36:03Z Moisture diffusion and heat transfer in plastic IC packages Tay, A.A.O. Lin, T. MECHANICAL & PRODUCTION ENGINEERING Finite-element simulation Heat transfer Moisture Plastic IC packages 10.1109/95.506103 IEEE Transactions on Components Packaging and Manufacturing Technology Part A 19 2 186-193 2014-06-17T05:15:20Z 2014-06-17T05:15:20Z 1996-06 Article Tay, A.A.O., Lin, T. (1996-06). Moisture diffusion and heat transfer in plastic IC packages. IEEE Transactions on Components Packaging and Manufacturing Technology Part A 19 (2) : 186-193. ScholarBank@NUS Repository. https://doi.org/10.1109/95.506103 10709886 http://scholarbank.nus.edu.sg/handle/10635/58508 A1996UU44400007 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Finite-element simulation Heat transfer Moisture Plastic IC packages
spellingShingle	Finite-element simulation Heat transfer Moisture Plastic IC packages Tay, A.A.O. Lin, T. Moisture diffusion and heat transfer in plastic IC packages
description	10.1109/95.506103
author2	MECHANICAL & PRODUCTION ENGINEERING
author_facet	MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Lin, T.
format	Article
author	Tay, A.A.O. Lin, T.
author_sort	Tay, A.A.O.
title	Moisture diffusion and heat transfer in plastic IC packages
title_short	Moisture diffusion and heat transfer in plastic IC packages
title_full	Moisture diffusion and heat transfer in plastic IC packages
title_fullStr	Moisture diffusion and heat transfer in plastic IC packages
title_full_unstemmed	Moisture diffusion and heat transfer in plastic IC packages
title_sort	moisture diffusion and heat transfer in plastic ic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/58508
_version_	1781781523119210496

Moisture diffusion and heat transfer in plastic IC packages

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