Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Tay, A.A.O., Goh, K.Y.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/58742
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Institution: National University of Singapore
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Summary:Proceedings - Electronic Components and Technology Conference

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