Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow
Proceedings - Electronic Components and Technology Conference
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sg-nus-scholar.10635-587422015-03-27T06:07:02Z Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow Tay, A.A.O. Goh, K.Y. MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 694-701 PECCA 2014-06-17T05:17:53Z 2014-06-17T05:17:53Z 1999 Article Tay, A.A.O.,Goh, K.Y. (1999). Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow. Proceedings - Electronic Components and Technology Conference : 694-701. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/58742 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
| description |
Proceedings - Electronic Components and Technology Conference |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Goh, K.Y. |
| format |
Article |
| author |
Tay, A.A.O. Goh, K.Y. |
| spellingShingle |
Tay, A.A.O. Goh, K.Y. Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| author_sort |
Tay, A.A.O. |
| title |
Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_short |
Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_full |
Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_fullStr |
Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_full_unstemmed |
Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow |
| title_sort |
study of delamination growth in the die-attach layer of plastic ic packages under hygrothermal loading during solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/58742 |
| _version_ |
1681085104002170880 |