Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow
Proceedings - Electronic Components and Technology Conference
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| Main Authors: | , |
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| Other Authors: | |
| Format: | Article |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/58742 |
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| Institution: | National University of Singapore |