Thin film failure using an interface delamination law
Proceedings of the Electronic Packaging Technology Conference, EPTC
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sg-nus-scholar.10635-588302015-02-10T18:59:09Z Thin film failure using an interface delamination law Liu, P. Cheng, L. Zhang, Y.W. MECHANICAL & PRODUCTION ENGINEERING Proceedings of the Electronic Packaging Technology Conference, EPTC 43-48 00313 2014-06-17T05:18:54Z 2014-06-17T05:18:54Z 1998 Article Liu, P.,Cheng, L.,Zhang, Y.W. (1998). Thin film failure using an interface delamination law. Proceedings of the Electronic Packaging Technology Conference, EPTC : 43-48. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/58830 NOT_IN_WOS Scopus |
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Proceedings of the Electronic Packaging Technology Conference, EPTC |
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MECHANICAL & PRODUCTION ENGINEERING |
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MECHANICAL & PRODUCTION ENGINEERING Liu, P. Cheng, L. Zhang, Y.W. |
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Liu, P. Cheng, L. Zhang, Y.W. |
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Liu, P. Cheng, L. Zhang, Y.W. Thin film failure using an interface delamination law |
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Liu, P. |
title |
Thin film failure using an interface delamination law |
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Thin film failure using an interface delamination law |
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Thin film failure using an interface delamination law |
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Thin film failure using an interface delamination law |
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Thin film failure using an interface delamination law |
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thin film failure using an interface delamination law |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/58830 |
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