Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact

Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact

10.1109/TCAPT.2006.880455

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Bibliographic Details
Main Authors: Luan, J.-E., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., Zhou, J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Ball grid array (BGA)
Bending
Drop test
Finite element modeling (FEM)
Solder joint reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59388
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Institution: National University of Singapore
Description
Summary:10.1109/TCAPT.2006.880455

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