Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact

Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact

10.1109/TCAPT.2006.880455

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Bibliographic Details
Main Authors: Luan, J.-E., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., Zhou, J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Ball grid array (BGA)
Bending
Drop test
Finite element modeling (FEM)
Solder joint reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59388
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Institution: National University of Singapore
id sg-nus-scholar.10635-59388
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spelling sg-nus-scholar.10635-593882023-10-25T20:01:06Z Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact Luan, J.-E. Tee, T.Y. Pek, E. Lim, C.T. Zhong, Z. Zhou, J. MECHANICAL ENGINEERING Ball grid array (BGA) Bending Drop test Finite element modeling (FEM) Solder joint reliability 10.1109/TCAPT.2006.880455 IEEE Transactions on Components and Packaging Technologies 29 3 449-456 ITCPF 2014-06-17T06:10:53Z 2014-06-17T06:10:53Z 2006-09 Article Luan, J.-E., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., Zhou, J. (2006-09). Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact. IEEE Transactions on Components and Packaging Technologies 29 (3) : 449-456. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2006.880455 15213331 http://scholarbank.nus.edu.sg/handle/10635/59388 000240242700002 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Ball grid array (BGA)
Bending
Drop test
Finite element modeling (FEM)
Solder joint reliability
spellingShingle Ball grid array (BGA)
Bending
Drop test
Finite element modeling (FEM)
Solder joint reliability
Luan, J.-E.
Tee, T.Y.
Pek, E.
Lim, C.T.
Zhong, Z.
Zhou, J.
Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
description 10.1109/TCAPT.2006.880455
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Luan, J.-E.
Tee, T.Y.
Pek, E.
Lim, C.T.
Zhong, Z.
Zhou, J.
format Article
author Luan, J.-E.
Tee, T.Y.
Pek, E.
Lim, C.T.
Zhong, Z.
Zhou, J.
author_sort Luan, J.-E.
title Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
title_short Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
title_full Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
title_fullStr Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
title_full_unstemmed Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
title_sort advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/59388
_version_ 1781781618875170816

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