Determining interfacial properties of submicron low- k films on Si substrate by using wedge indentation technique

Determining interfacial properties of submicron low- k films on Si substrate by using wedge indentation technique

10.1063/1.2749473

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Bibliographic Details
Main Authors: Yeap, K.B., Zeng, K., Jiang, H., Shen, L., Chi, D.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59889
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/59889

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