Evelopment of novel lead-free solder composites using carbon nanotube reinforcements

Evelopment of novel lead-free solder composites using carbon nanotube reinforcements

10.1142/S0219581X0500367X

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Bibliographic Details
Main Authors: Nai, S.M.L., Gupta, M., Wei, J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Carbon nanotubes
Composites
Lead-free solder
Mechanical properties
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60224
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Institution: National University of Singapore
Description
Summary:10.1142/S0219581X0500367X

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