Evelopment of novel lead-free solder composites using carbon nanotube reinforcements

10.1142/S0219581X0500367X

Saved in:
Bibliographic Details
Main Authors: Nai, S.M.L., Gupta, M., Wei, J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60224
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items