Finite element modeling of electronic packages subjected to drop impact

10.1109/TCAPT.2005.848580

Saved in:

Bibliographic Details
Main Authors:	Tan, V.B.C., Tong, M.X., Lim, K.M., Lim, C.T.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Ball grid array (BGA) Drop impact Finite element (FE) simulation
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60324
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-60324
record_format	dspace
spelling	sg-nus-scholar.10635-603242024-11-13T14:49:09Z Finite element modeling of electronic packages subjected to drop impact Tan, V.B.C. Tong, M.X. Lim, K.M. Lim, C.T. MECHANICAL ENGINEERING Ball grid array (BGA) Drop impact Finite element (FE) simulation 10.1109/TCAPT.2005.848580 IEEE Transactions on Components and Packaging Technologies 28 3 555-560 ITCPF 2014-06-17T06:21:51Z 2014-06-17T06:21:51Z 2005-09 Article Tan, V.B.C., Tong, M.X., Lim, K.M., Lim, C.T. (2005-09). Finite element modeling of electronic packages subjected to drop impact. IEEE Transactions on Components and Packaging Technologies 28 (3) : 555-560. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2005.848580 15213331 http://scholarbank.nus.edu.sg/handle/10635/60324 000231577700022 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Ball grid array (BGA) Drop impact Finite element (FE) simulation
spellingShingle	Ball grid array (BGA) Drop impact Finite element (FE) simulation Tan, V.B.C. Tong, M.X. Lim, K.M. Lim, C.T. Finite element modeling of electronic packages subjected to drop impact
description	10.1109/TCAPT.2005.848580
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tan, V.B.C. Tong, M.X. Lim, K.M. Lim, C.T.
format	Article
author	Tan, V.B.C. Tong, M.X. Lim, K.M. Lim, C.T.
author_sort	Tan, V.B.C.
title	Finite element modeling of electronic packages subjected to drop impact
title_short	Finite element modeling of electronic packages subjected to drop impact
title_full	Finite element modeling of electronic packages subjected to drop impact
title_fullStr	Finite element modeling of electronic packages subjected to drop impact
title_full_unstemmed	Finite element modeling of electronic packages subjected to drop impact
title_sort	finite element modeling of electronic packages subjected to drop impact
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60324
_version_	1821193704321318912

Finite element modeling of electronic packages subjected to drop impact

Similar Items