Finite element modeling of electronic packages subjected to drop impact

• Main Authors: Tan, V.B.C., Tong, M.X., Lim, K.M., Lim, C.T.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Ball grid array (BGA); Drop impact; Finite element (FE) simulation
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/60324
• Institution: National University of Singapore

10.1109/TCAPT.2005.848580