Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications
10.1007/s10854-008-9610-8
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2014
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sg-nus-scholar.10635-605402023-10-26T07:18:19Z Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications Sekhar, V.N. Chai, T.C. Balakumar, S. Shen, Lu. Sinha, S.K. Tay, A.A.O. Yoon, S.W. MECHANICAL ENGINEERING 10.1007/s10854-008-9610-8 Journal of Materials Science: Materials in Electronics 20 1 74-86 2014-06-17T06:24:26Z 2014-06-17T06:24:26Z 2009 Article Sekhar, V.N., Chai, T.C., Balakumar, S., Shen, Lu., Sinha, S.K., Tay, A.A.O., Yoon, S.W. (2009). Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications. Journal of Materials Science: Materials in Electronics 20 (1) : 74-86. ScholarBank@NUS Repository. https://doi.org/10.1007/s10854-008-9610-8 09574522 http://scholarbank.nus.edu.sg/handle/10635/60540 000261970500012 Scopus |
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National University of Singapore |
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Asia |
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Singapore Singapore |
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| description |
10.1007/s10854-008-9610-8 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Sekhar, V.N. Chai, T.C. Balakumar, S. Shen, Lu. Sinha, S.K. Tay, A.A.O. Yoon, S.W. |
| format |
Article |
| author |
Sekhar, V.N. Chai, T.C. Balakumar, S. Shen, Lu. Sinha, S.K. Tay, A.A.O. Yoon, S.W. |
| spellingShingle |
Sekhar, V.N. Chai, T.C. Balakumar, S. Shen, Lu. Sinha, S.K. Tay, A.A.O. Yoon, S.W. Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications |
| author_sort |
Sekhar, V.N. |
| title |
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications |
| title_short |
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications |
| title_full |
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications |
| title_fullStr |
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications |
| title_full_unstemmed |
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications |
| title_sort |
influence of thickness on nanomechanical behavior of black diamond™ low dielectric thin films for interconnect and packaging applications |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/60540 |
| _version_ |
1781781865065086976 |