Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications

10.1007/s10854-008-9610-8

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Bibliographic Details
Main Authors:	Sekhar, V.N., Chai, T.C., Balakumar, S., Shen, Lu., Sinha, S.K., Tay, A.A.O., Yoon, S.W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60540
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Institution:	National University of Singapore

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