Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph

Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph

10.1117/1.1668284

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Bibliographic Details
Main Authors: Tay, C.J., Wang, S.H., Quan, C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Height inspection
Image processing
Micro-ball grid array (micro-BGA)
Optical shadowgraph
Wafer bump inspection
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60555
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Institution: National University of Singapore
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Summary:10.1117/1.1668284

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