Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
10.1117/1.1668284
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Main Authors: | Tay, C.J., Wang, S.H., Quan, C. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/60555 |
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Institution: | National University of Singapore |
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