Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph

10.1117/1.1668284

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Bibliographic Details
Main Authors:	Tay, C.J., Wang, S.H., Quan, C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Height inspection Image processing Micro-ball grid array (micro-BGA) Optical shadowgraph Wafer bump inspection
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60555
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60555
record_format	dspace
spelling	sg-nus-scholar.10635-605552023-10-30T21:02:27Z Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph Tay, C.J. Wang, S.H. Quan, C. MECHANICAL ENGINEERING Height inspection Image processing Micro-ball grid array (micro-BGA) Optical shadowgraph Wafer bump inspection 10.1117/1.1668284 Optical Engineering 43 4 963-970 OPEGA 2014-06-17T06:24:37Z 2014-06-17T06:24:37Z 2004-04 Article Tay, C.J., Wang, S.H., Quan, C. (2004-04). Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph. Optical Engineering 43 (4) : 963-970. ScholarBank@NUS Repository. https://doi.org/10.1117/1.1668284 00913286 http://scholarbank.nus.edu.sg/handle/10635/60555 000220968500029 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Height inspection Image processing Micro-ball grid array (micro-BGA) Optical shadowgraph Wafer bump inspection
spellingShingle	Height inspection Image processing Micro-ball grid array (micro-BGA) Optical shadowgraph Wafer bump inspection Tay, C.J. Wang, S.H. Quan, C. Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
description	10.1117/1.1668284
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, C.J. Wang, S.H. Quan, C.
format	Article
author	Tay, C.J. Wang, S.H. Quan, C.
author_sort	Tay, C.J.
title	Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
title_short	Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
title_full	Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
title_fullStr	Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
title_full_unstemmed	Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
title_sort	inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60555
_version_	1781781867813404672

Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph

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